Georgia Tech
Microwave Circuit Technology Group (MiRCTECH)
Collage of images for MiRCTech

Microwave Circuit Technology Group

The Microwave Circuit Technology Group was established in 2001 by Dr. John Papapolymerou and focuses on research in the area of microwave engineering. More specifically, MIRCTech group members study and develop novel microwave structures using techniques such as micromachining, RF Micro-Electro-Mechanical System (RF MEMS) devices and Electromagnetic-Bandgap (EBG) structures.

There is also an effort on integration of planar RF and microwave circuits (e.g. antennas) on CMOS grade Silicon wafers that traditionally exhibit high loss at this frequency range, as well as an effort on monolithic mixers and multipliers and THz planar structures. You can see some samples of the circuits fabricated by the MIRCTech group here.

The laboratory is equipped with several PCs and workstations that include a variety of software tools for electromagnetic and circuit simulations (HFSS, HP-ADS, Sonnet). In addition, various microwave measurement equipments are available to students for their projects (network and spectrum analyzers, power meters, synthesizers etc.). For fabrication purposes students can use the ECE Microelectronics Research Center (MiRC) that houses state-of-the-art equipment for integrated circuit development.


MiRCTECH News

Graduate Research Assistance Position Opening

The Microwave Circuit Technology (MircTech) Group of Professor John Papapolymerou has an opening for a Graduate Research Assistant in the area of microwave circuits and antennas starting in the Fall of 2011. More specifically, we are looking for a highly motivated graduate student to work on the design and development of 16-element integrated antenna array with low-noise amplifiers and phase shifters based on two different semiconductor technologies (SiGe and GaN).

The project includes the development of components/systems capable of handling high RF power without sacrificing performance or affordability. Development of lightweight packaging technology that is capable of dissipating the heat produced by semiconductor modules will also be addressed. The packaging material used in such a module will be low-cost, easy to use, and have good electrical performance.

Required Qualifications: Strong background in RF engineering and antennas.  US citizenship.Preferred Qualifications:  2nd or 3rd year Ph.D. student.

Please forward a cover letter and short resume to Prof. John Papapolymerou at the following email address:   papapol@ece.gatech.edu

 

NASA Awards MircTech and Georgia Tech $2.4M for lightweight environmental RADAR development

NASA-Sponsored Radar sub-arrays on a flexible polymer substrate Dr. John Papapolymerou and graduate students, showing the NASA-Sponsored Radar System Micro-electromechanical systems (MEMS) Designed and Fabricated at MiRCTECH, DARPA Sponsorship




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Last modified August 27, 2011.


Microwave Circuit Technology Group • Technology Square Research Building (TSRB) • 85 5th Street, NW • Atlanta, GA 30308
Phone: 404.385.6401 • Office hours: M-F 9:00 p.m. to 5:00 p.m.
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