Georgia Tech
School of Electrical and Computer Engineering
Microwave Circuit Technology Group (MiRCTECH)
Collage of images for MiRCTech



Chad Patterson
Research Assistant and PhD Student

Chad Patterson

Graduate Research Assistant

Contact Information

Mailing address:
Technology Square Research Building
85 Fifth Street NW, Suite 415
Atlanta, GA 30308
Phone: (404) 894-0531
Email: cpatterson@gatech.edu

Background

Mr. Patterson received the B.S. and M.S. degree in electrical engineering from the Georgia Institute of Technology in 2006 and 2008, respectively. He is currently a member of the Microwave Circuit Technology (MircTech) group at Georgia Tech working to pursue his doctoral degree. His research focuses on the design, fabrication and characterization of microwave/ millimeter wave passive components and packaging solutions for next-generation communication and radar antennas. Prior to joining the MircTech team, he was employed as an intern at the Army Research Laboratory in Adelphi, MD, where he worked on high frequency antenna design and automated antenna measurement systems.

Research Interests

  • Millimeter Wave Component Packaging
  • 3D Packaging Techniques
  • RF MEMs Design
  • High Frequency Antenna Design, Packaging and Integration

Experience

  • Research Assistant (05/07-present) - Georgia Institute of Technology
  • Summer Intern (5/02-8/02, 5/03-8/03, 5/05-8/05) - Army Research Laboratory
    • Used LabVIEW to automate the process for antenna data acquisition and analysis in an Anechoic Chamber.
    • Designed, simulated and fabricated 2D Antenna Arrays.

Publications

  1. C.E. Patterson, T.K. Thrivikraman, S.K. Bhattacharya, C.T. Coen, J.D. Cressler, J. Papapolymerou, “Development of a multilayer organic packaging technique for a fully embedded T/R module,” accepted to European Microwave Conference, 2011.
  2. C.E. Patterson, S.K. Bhattacharya, J. Zepess, S. Leiphart, W.G. Trueheart, J. Ajoian, Z. Coffman, J. Papapolymerou, “A 7.45 GHz BAW filter on a low cost 3D organic package,” accepted to IEEE International Microwave Symposium, 2011.
  3. C.A.D. Morcillo, C.E. Patterson, B. Lacroix, T. Thrivikraman, C.H. Poh, C.T. Coen, J.D. Cressler, J. Papapolymerou, “A lightweight, 64-element, Organic Phased Array with Integrated Transmit-Receive SiGe Circuitry in the X Band,” accepted to IEEE International Microwave Symposium, 2011.
  4. W.T. Khan, S.K. Bhattacharya, C.E. Patterson, G.E. Ponchak, J. Papapolymerou, “Low Cost 60 GHz RF Front End Receiver on Organic Substrate,” accepted to IEEE International Microwave Symposium, 2011.
  5. E.A. Juntunen, W.T. Khan, C.E. Patterson, S.K. Bhattacharya, D. Dawn, J. Laskar, J. Papapolymerou, “An LCP Packaged High-Power, High-Efficiency CMOS Millimeter-Wave Oscillator,” accepted to IEEE International Microwave Symposium, 2011.
  6. C.E. Patterson, T.K. Thrivikraman, A.M. Yepes, S.M. Begley, S.K. Bhattacharya, J.D. Cressler, J. Papapolymerou, “A lightweight organic X-band phased array with integrated SiGe amplifiers and phase shifters,” in IEEE Trans. on Antennas and Propagation, vol. 59, issue 1, pp. 100-109, 2011.
  7. C.E. Patterson, T.K. Thrivikraman, A.M. Yepes, S.K. Bhattacharya, J.D. Cressler, J. Papapolymerou, “Implementation of a low cost, lightweight X-band antenna with integrated SiGe RF electronics,” in IEEE International Geoscience and Remote Sensing Symposium, pp. 681-684, 2010.
  8. C.E. Patterson, A.M. Yepes, T.K. Thrivikraman, S.K. Bhattacharya, J.D. Cressler, J. Papapolymerou, “A lightweight X-band organic antenna array with integrated SiGe amplifier,” in IEEE Radio & Wireless Symposium, pp. 84-87, 2010.
  9. C.H.J. Poh, T.K. Thrivikraman, S.K. Bhattacharya, C.E. Patterson, J.D. Cressler, J. Papapolymerou, “An LCP Package Model for Use in Chip/Package Co-Design of an X-band SiGe Low Noise Amplifier,” in IEEE EPEPS, pp. 203-206, 2009.
  10. C.E. Patterson, T.K. Thrivikraman, S.K. Bhattacharya, C. Poh, J.D. Cressler, J. Papapapolymerou, “Organic wafer-scale packaging for X-band SiGe low noise amplifier,” in 39th European Microwave Conference, pp. 141-144, 2009.
  11. C. Patterson, S. Horst, S.K. Bhattacharya, J.D. Cressler, J. Papapolymerou, “Low cost organic packaging for silicon based mm-wave wireless systems,” in 38th European Microwave Conference, pp. 1242-1245, 2008.

Last modified February 9, 2012.

Microwave Circuit Technology Group • Technology Square Research Building (TSRB) • 85 5th Street, NW • Atlanta, GA 30308
Phone: 404.385.6401 • Office hours: M-F 9:00 p.m. to 5:00 p.m.
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