Dr. Swapan K. Bhattacharya
Research Senior Scientist
Contact Information
Mailing Address:
Technology Square Research Building
85 Fifth Street NW, Room 416A
Atlanta, GA 30308
USA
Phone: (404) 385 3173
Email: swapan@ece.gatech.edu
Background
Dr. Bhattacharya received his M.S. and Ph.D. Degrees from the Indian Institute of Technology, Kharagpur, India. Since 1996, he has been working on embedded thin film passives and ultra-high density packaging at Georgia Tech. His current research focus is Embedded Actives, MEMS, Antennas, and RFIDs on low-loss organic substrates and nano-structured materials for microelectronics applications. He was the organizer and co-instructor of the course “Electronic Packaging Substrate Fabrication”, ECE/ChE 4755 at Georgia Tech. He offers short courses on embedded passives in several National and International Conferences.
Dr. Bhattacharya is the member of the organizing committees of Electronic Components and Technology Conference (ECTC) and InterPACK. He has co-authored over 150 technical publications, 3 US Patents, and 5 Book Chapters. He is the editor of the book “Metal-Filled Polymers” published by Marcel Dekker, Inc.
Research Interests
- Organic MEMS
- Embedded Actives and Passive
- Nano-structured materials
- 3D Architecture with rigid/flex substrates
- Bio-sensors
Publications
Book Chapters
1. G. Jha, S. K. Bhattacharya, “Nanogrannular magnetic core inductors: Design, fabrication, and packaging”, in “Nanopackaging: Technologies and Electronics Packaging”, Editors, J. Morris and Debendra Mallik, Springer, March, 2008.
2. J. Papapolymerou, M. Tentzeris, J. Laskar, S. K. Bhattacharya, “Radio Frequency System-on-Package”, in “Introduction to System-on-Package”, Edited by Rao Tummala and M. Swaminathan, Chapter 5, 2008, pp 261-316.
3. J. Xu, S. K. Bhattacharya, J. Papapolymerou, C. P. Wong, S. Wang, “Embedded Passives” in “Materials for Advanced Packaging”, Editors, C. P. Wong and D. Lu, Springer, 2008 (to appear).
4. R. Tummala, V. Sundaram, K. Lim, L. Wan, D. Guidotti, F. Liu, S. K. Bhattacharya, P. Raj, I. Abothu, R. Doraiswami, R. Pucha, S. Sitaraman, M. Tentzeris, J. Laskar, G. K. Chang, M. Swaminathan, “First System-on-Package Demonstration with digital, optical, and RF for broadband applications”, The World of Electronic Packaging and System Integration, Brend Michael and Rolf Aschenbrenner, Editors, ddp goldenbogen, Dresden, Germany, 2004, pp 1-9. 5. J. Prymak, S. K. Bhattacharya, and K. W. Paik, “Fundamentals of discrete, integrated and integral components” in “Fundamentals of Microsystems Packaging”, Edited by Rao R Tummala, Chapter 11, McGraw-Hill Publishers, New York, 2001, pp 420-465.
US patents filed
1. S. K. Bhattacharya and D. F. Baldwin, "A system and method for providing a low temperature curable gallium alloy for multichip module substrates", Serial Number 784,691, US Patent 20010044206, issued February 2001.
2. B. Woo, P. Raj, C. Yoon, R. Tummala, R. Abothu, S. K. Bhattacharya, “Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materials”, US Patent Application 20060258327, Serial No. 428780, May 2006.
3. S. K. Bhattacharya, S. Horst, J. Papapolymerou, M. Tentzeris, “Embedded Thin Film Resistors on body”, US Patent Application 20070085654, April, 2007. Journal Papers
1. S. Courrèges, C. Morcillo, S. K. Bhattacharya, and J. Papapolymerou, “Low cost multi-layer filters with stacked square loop resonators”, IEEE Transactions on Components and Packaging Technologies (submitted).
2. S. K. Bhattacharya, K. Brownlee, C. P. Wong, R. Tummala, “Liquid crystal polymers for high performance SOP application”, IEEE Transaction on Electronics Manufacturing, Accepted.
3. N. Kingsley, S. K. Bhattacharya, J. Papapolymerou, “Moisture lifetime testing of RF MEMS switches packaged in liquid crystal polymer”, IEEE Transactions on Component and Packaging Technologies, Vol 31, No 2, June, 2008, pp 345-350.
4. J. Xu, K. Moon, S. K. Bhattacharya, P. Pramanik, C.P. Wong, "Optimization of Epoxy-Barium Titanate Nanocomposites for high Performance Embedded Capacitor Components", IEEE Transactions on Component Packaging Technologies, Vol 30, No 2, June 2007, pp 248-253.
5. K. J. Lee, M. Damani, R. Pucha, S. K. Bhattacharya, S. Sitaraman, R. Tummala, “Reliability modeling and assessment of embedded capacitors on organic substrates”, IEEE Transactions on Component and Packaging Technology, Vol 30, No. 1, March, 2007, pp 152-162.
6. S. K. Bhattacharya, M. Varadarajan, P. Chahal, G. Jha, R. Tummala, “A novel electroless plating for embedding thin film resistors on BCB”, Journal of Electronic Materials, Vol 36, No. 3, March 2007, pp 242-244.
7. M. Varadarajan, K. Lee, S. K. Bhattacharya, R. Pucha, S. Sitaraman, R. Tummala, “Printed circuit board miniaturization with embedded passives and sequential build-up process methodologies”, Journal of the Indian Institute of Science, Vol 86, December, 2006, pp 639-654.
8. J. Xu, S. K. Bhattacharya, P. Pramanik, C. P. Wong, “High dielectric constant polymer-ceramic (epoxy varnish-barium titanate) nanocomposite at moderate filler loading for embedded capacitor”, Journal of Electronic Materials, Vol 35, No 11, November 2006, pp 2009-2015.
9. S. Banerji, P. M. Raj, S. K. Bhattacharya, R. Tummala, “Warpage-induced lithographic limitations of FR-4 and the need for novel board materials for future microvia and global interconnect needs”, IEEE Transactions on Advanced Packaging, Volume 28, Issue 1, Feb 2005, pp 102 – 113.
10. N. Kumbat, P. Raj, S. Hedge, R. Pucha, V. Sundaram, S. Hayes, S. K. Bhattacharya, S. Sitaraman, R. Tummals, “Novel board materials technology for next generation microelectronic packaging”, Ceramic Transactions, Vol 167, 2005, pp 371-382.
11. R. Tummala, M. Swaminathan, M. Tentzeris, J. Laskar, G. Chang, S.Sitaraman, D. Keezer, D.Giudotti, R. Huang, K. Lim, L. Wan, S. K. Bhattacharya, V. Sundaram, F. Liu, P. M. Raj, “SOP for Miniaturized Mixed-Signal Computing, Communication and Consumer Systems of the Next Decade”, IEEE Transaction on Advanced Packaging, Volume 27, Issue 2, May 2004, pp 250 – 267 (BEST PAPER AWARD).
12. D. Balaraman, P. M. Raj, I. Abothu, S. K. Bhattacharya, S. Dalmia, L. Wan, M. D. Sacks, M. Swaminathan, R. Tummala, “Barium titanate films by low temperature hydrothermal techniques for next generation of packaging applications”, Journal of Electroceramics, Vol 13, 2004, pp 95-100.
13. P. Raj, S. Atmur, V. Sundaram, F. Liu, I. Abothu, S. K. Bhattacharya, R. Tummala, G. White, “Fundamental limits of organic boards and packages and the need for novel ceramic boards for next generation electronic packaging”, Journal of Electroceramics, Vol 13, 2004, pp 417-422.
14. K. Shinotani, P. Raj, M. Seo, S. Bansal, H. Sakurai, S. K. Bhattacharya, R. Tummala, “Evaluation of alternative materials for system-on-package substrates”, IEEE Transaction on Components and Packaging Technologies, Volume 27, Issue 4, Dec. 2004, pp 694 – 701.
15. S. K. Bhattacharya, R. Doraiswami, L. Conrad, G. May, R. Tummala, “The development and implementation of a hands-on multidisciplinary product development course series at Georgia Tech”, World Transaction on Engineering and Technology Education, Vol 2, 2003, pp 407-410.
16. H. Windlass, P. Raj, D. Balaraman, S. K. Bhattacharya, R. Tummala, “Polymer-Ceramic Nanocomposite Capacitors for System-On-Package (SOP) Applications”, IEEE Transactions on Advanced Packaging, Vol 26, No 1, 2003, pp 10-16.
17. H. Windlass, P. M. Raj, D. Balaraman, S. K. Bhattacharya, R. Tummala , “Colloidal Processing of Polymer Ceramic Nanocomposites for Integral Capacitors”, IEEE Transactions on Electronics Manufacturing, Volume 26, No 2, April 2003, pp 100-105.
18. S. K. Bhattacharya, K. Moon, R. Tummala, G. May, “Meniscus Coating: A low-cost polymer deposition method for System-on-Package (SOP) substrates”, IEEE Transactions on Electronics Manufacturing, Volume 26, No 2, April 2003, pp 110-114.
19. S. K. Bhattacharya, H. Windlass, P. Raj, D. Balaraman, , R. Tummala, “Process development for PWB compatible embedded capacitors”, Circuit world, Journal of the Institute of Circuit Technology, Vol 30, No 1, 2003, pp 31-35 (Invited paper).
20. J. Wu, S. K. Bhattacharya, C. Lloyd, R. Tummala, C.P. Wong, H. Pogge, "Development of high-performance interfill materials for System Chips technology", IEEE Transactions on Components and Packaging Technologies , Vol 25, Number 2, June 2002, pp 217-223.
21. S. K. Bhattacharya, R. Tummala, “Nanocomposite capacitors for application as MCM-L compatible integral capacitors”, ASME Journal of Electronic Packaging, Volume 124, March 2002, pp 1-6.
22. S. K. Bhattacharya, S. Bhatevara, D. Sutter, E. Kamen, G. May, R. Tummala, “An automated workcell for meniscus coating on Large Area Packaging substrates”, IEEE Transactions on Components and Packaging Technologies , Volume 24, No. 4, December, 2001, pp 625-630.
23. S. K. Bhattacharya, R. Tummala, "Integral passives for next generation of electronic packaging: Application of epoxy/ceramic nanocomposites as integral capacitors", Microelectronics Journal, Vol 32, No. 1, 2001, pp 11-19.
24. S. K. Bhattacharya, R. Tummala, “Next generation integral passives: Materials, processes, and integration of resistors and capacitors on PWB substrates”, Journal of Materials Science, Materials in Electronics, 11 (2000) 253-268.
25. S. K. Bhattacharya, B. Gardner, J. Qu, D. Baldwin, R. Tummala, “Low-cost large area processing using small area substrates – A novel multi-tiled palletization concept for MCM-D thin film process”, IEEE Transactions on Advanced Packaging, Vol. 23, No. 4, November, 2000, pp 661-671.
26. S. K. Bhattacharya, S. Bhatevara, H. Morales, S. Kauffman, E. Kamen, G. May, “Low-cost, high throughput, large area meniscus coating for packaging substrates”, IEEE Transactions on Electronics Manufacturing, Vol. 23, No. 4, 2000, pp 267-276.
27. O. Misman, S. K. Bhattacharya, A. Erbil, R. Tummala, “PWB compatible high value integral capacitors by MOCVD”, Journal of Materials Science, Materials in Electronics, 11 (2000) 657-660.
28. S. K. Bhattacharya, I. C. Ume, D. Baldwin, "Warpage of conductive gallium alloy via-filled stainless steel substrate for large area microelectronic packaging", International Journal of Microcircuits and Electronic Packaging, Volume 23, Number 3, 2000, pp 309-319.
29. A. Dang, I. C. Ume, S. K. Bhattacharya, “A study on warpage of flexible SS substrates for large area MCM-D packaging”, Transactions ASME, Journal of Electronic Packaging, Vol. 122 No. 2, June, 2000, pp 86-91.
30. S. K. Bhattacharya, D. Baldwin, “A low temperature processable ternary gallium alloy for application as via filling material for microelectronic packaging”, J. Materials Science, Materials in Electronics, 11 (2000) 653-656.
31. A. Dang, I. C. Ume, S. K. Bhattacharya, “Measurement of dynamic warpage during thermal cycling of dielectric coated stainless steel substrates for large area MCM-D packaging”, Journal of Electronic Packaging, Vol 122, No. 2, June, 2000, pp 77-85.
32. S. K. Bhattacharya, I. C. Ume, A. Dang, “Warpage measurement of large area multi-tiled silicon substrates at various processing conditions”, IEEE Transactions on Component and Packaging Technologies, Vol 23, No. 3, September, 2000, pp 497-504.
33. A. Dang, I. C. Ume, S. K. Bhattacharya, “Process induced warpage in multi-tiled alumina substrates for large area MCM-D processing”, IEEE Transactions on Advanced Packaging, Vol. 23, No. 3, August 2000, pp 436-446.
34. S. K. Bhattacharya, J. Park, R. Tummala, M. Allen, “A fully integrated passive module for filter application", Journal of Materials Science, Materials in Electronics, 11 (2000) 455-460.
35. H. Yoon, J. Hou, S. K. Bhattacharya, A. Chatterjee, M. Swaminathan, “Fault detection and automated fault diagnosis for embedded integrated electrical passives”, Journal of VLSI Signal Processing, 21 (1999) 265-276. Technical Magazines
1. S. K. Bhattacharya, C. Patterson, J. Papapolymerou, “Embedded RF Component and Devices in 3D LCP Package: Part 1. Embedded Active”, Advanced Packaging Newsletter, August 6, 2008.
2. S. K. Bhattacharya, M. Tentzeris, A. Rida, L. Yang, R. Vyas, “RFID on paper substrates”, SMT Magazine, Vol 21, Issue 10, October, 2007.
3. R. Tummala, G. White, V. Sundaram, S. K. Bhattacharya, “SOP: The Microelectronics for the 21st Century with Integral Passive Integration”, Advancing Microelectronics, 27 (2000) pp 13-19.
4. S. K. Bhattacharya, D. Baldwin, S. Sitaraman, J. Qu, C. P. Wong, I. C. Ume, R. R. Tummala, “Low Cost MCM: Large area packaging using small area substrates, Part 1”, High-Density Interconnect International, September, 2000, pp 20-25.
5. S. K. Bhattacharya, D. Baldwin, “Gallium alloy breakthrough for via filling application”, Advanced Packaging, September, 2000, pp 61-64.
6. S. K. Bhattacharya, D. Baldwin, S. Sitaraman, J. Qu, C. P. Wong, I. C. Ume, R. R. Tummala, “Low Cost MCM: Large area packaging using small area substrates, Part 2”, High-Density Interconnect International, October 2000, pp 36-39. Conference Papers
1. D. Chung, S. K. Bhattacharya, J. Papapolymerou, ”A stitching technique for expanding 3D multi-layer antenna arrays in Ku band using small array units”, 58th Electronic Components and Technology Conference, Orlando, May 2008, pp 175-178.
2. C. Chen, D. Chung, S. K. Bhattacharya, J. Papapolymerou, D, Peroulis, “Low-Cost 3-D Integration of RF and Micro-Cooling Systems”, European Microwave Conference, Amsterdam, October, 2008.
3. A. Rida, L. Yang, S. K. Bhattacharya, M. Tentzeris, “A 3D packaging architecture using paper as a dielectric medium”, 58th Electronic Components and Technology Conference, Orlando, May 2008, pp 371-373. 4. C. Patterson, S. Horst, J. Papapolymerou, J. Cressler, “Low cost organic packaging for silicon based mm-wave wireless systems”, European Microwave Conference, Amsterdam, October, 2008.
5. J. Papapolymerou, D. Chung, S. K. Bhattacharya, “Recent Advances in the Development of a Lightweight RF MEMS Phased Array for Space Applications”, IMAPS Conference on Military, Aerospace, Space and Homeland Security (MASH), Baltimore, MD, April, 2008.
6. D. Chung, S. K. Bhattacharya, J. Papapolymerou, “Development of a Lightweight flexible 16x16 antenna array with RF MEMS phase shifters at 14 GHz”, NASA ESTC, June, 2008.
7. S. Basat, S. K. Bhattacharya, A. Rida, T. Vidal, R. Vyas, L. Yang, M. Tentzeris, “Characterization of Paper Substrates for Ultra-Low-Cost Integrated RFID Tags for Chemical, Pharmaceutical, and Bio-Sensing Applications”, 57th Electronic Components and Technology Conference, Reno, May 2007, pp 1977-1980.
8. A. Rida, S. K. Bhattacharya, S. Basat, T. Vidal , R. Vyas, L. Yang, M. Tentzeris, “Novel manufacturing Processes for Paper-Based RFID Tags with Enhanced Wireless Intelligence”, 57th Electronic Components and Technology Conference, Reno, May 2007, pp 773-776.
9. R. Vyas, A Rida, S. K. Bhattacharya, M. M Tentzeris, “Liquid Crystal Polymer (LCP): the ultimate solution for low- cost RF flexible electronics and antenna”, IEEE Antenna Propagation Society Conference, Honolulu, 2007, pp 1729-1732.
10. A. Rida, L. liang, R. Vyas, S. K. Bhattacharya, M. Tentzeris, “Design and Integration of Inkjet-printed Paper-Based UHF Components for RFID and Ubiquitous Sensing Applications”, European Microwave Conference, Munich, October, 2007, pp 724-727.
11. S. Horst, S. K. Bhattacharya, J. Papapolymerou, M. Tentzeris, “Monolithic low cost Ka band Wilkinson power divider on flexible organic substrates”, 57th Electronic Components and Technology Conference, Reno, May 2007, pp 1851-1854.
12. E. Engin, A. Tambawala, M. Swaminathan, S. K. Bhattacharya, P. Pramanik, K. Yamazaki, “Causal Modeling and Extraction of Dielectric Constant and Loss Tangent for Thin Dielectrics”, International Symposium on Electromagnetic Compatibility, August, 2007, pp 1-5.
13. A. Ege Engin, A. Tambawala, M. Swaminathan, S. K. Bhattacharya, P. Pramanik, K. Yamazaki, “Frequency-dependent dielectric constant and loss tangent of thin film delectrics using a Rapid Solver”, 57th Electronic Components and Technology Conference, Reno, May 2007, pp 792-797.
14. S. K. Bhattacharya, M. Tentzeris, L. Yang, S. Basat, A. Rida “Flexible LCP and Paper-based Substrates with Embedded Actives, Passives, and RFIDs”, Polytronics 2007, Tokyo, Japan, January 2007 (Keynote Speaker).
15. R. Vyas, A Rida, S. K. Bhattacharya, M. M Tentzeris, “Liquid Crystal Polymer (LCP): the ultimate solution for low- cost RF flexible electronics and antennae”, International Conference on Polymers for Defense and Aerospace, Toulouse, France, 2007.
16. Y. Toyota, T. Kim, E. Engin, S. K. Bhattacharya, M. Swaminathan, “Size reduction of electronic bandgap structures with new geometries and materials”, Design Con, Santa Clara, January, 2007.
17. A. Ege Engin, A. Tambawala, M. Swaminathan, S. K. Bhattacharya, “Dielectric Constant and Loss Tangent Characterization of Thin High-K Dielectrics Using Corner-to-Corner Plane Probing”, EPEP Conference, Arizona, October, 2006.
18. S. Basat, S. K. Bhattacharya, A. Rida, S. Johnston, M. Tentzeris, “Fabrication and Assembly of Novel High-Read Ranage High-Efficiency Read/Write UHF RFID Antennas and Chips Embedded in Flexible LCP Substrate”, 56th Electronic Components and Technology Conference, San Diego, May, 2006, pp 1352-1355.
19. S. Basat, S. K. Bhattacharya, L. Yang, A. Rida, M. Tentzeris, J. Laskar, “Design of a novel high-efficiency UHF RFID antenna on flexible substrate with high read-range capability”, IEEE Antennas and Propagation Society International Symposium, July 2006 , Albuquerque, NM, pp 1031-1034.
20. V. Sundaram, R. Tummala, B. Wiedenman, I. Abothu, S. K. Bhattacharya, M. Varadarajan, W. Sherwood, “Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration”, 56th Electronic Components and Technology Conference, San Diego, May, 2006, pp 1375-1380.
21. R. Doraiswami, S. K. Bhattacharya, E. Erdem, K. Gal, “Shape Memory Capacitors for Next Generation Embedded Tunable Actives”, 56th Electronic Components and Technology Conference, San Diego, May, 2006, pp 520-522.
22. J. Xu, S. K. Bhattacharya, C. P. Wong, K. Moon, J. Lu, B. Englert, P. Pramanik, “Large-Area Processable High-k Nanocomposite-Based Embedded Capacitors”, 56th Electronic Components and Technology Conference, San Diego, May, 2006, pp 1520-1532.
23. Y. Toyota, T. Kim, E. Engin, S. K. Bhattacharya, M. Swaminathan, “Size reduction of electronic bandgap structures with new geometries and materials”, 56th Electronic Components and Technology Conference, San Diego, May, 2006, pp 1784-1789.
24. S. Horst, S. K. Bhattacharya, S. Johnston, J. Papapolymerou, M. Tentzeris, “Modeling and Characterization of Thin Film Broadband Resistors on LCP for RF Applications”, 56th Electronic Components and Technology Conference, San Diego, May, 2006, pp 1751-1755.
25. S. K. Bhattacharya, M. Varadarajan, S. Johnston, K. Lee, R. Tummala, S. Sitaraman, J. Papapolymerou, M. Tentzeris, “Embedded Thin Film resistors on BCB by low-cost PWB compatible electroless plating and direct foil transfer processes”, Advanced Packaging Materials: Processes, Properties and Interfaces, Proceedings International Symposium, March 2006, Atlanta, Georgia, pp 116-124.
26. M. Varadarajan, K. Lee, S. K. Bhattacharya, A. Bhattacharjee, L. Wan, R. Pucha, R Tummala, S. Sitaraman, “Studies on Design, Fabrication and Reliability Assessment of Embedded Passives on a High-Density Interconnect (HDI) Organic substrate using a sequential build-up process; Proceedings of the IEEE-CPMT HDP06 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, June 27-30, 2006, Shanghai, pp 98-108.
27. S. K. Bhattacharya, “Liquid crystal Polymers for RF Applications”, IPC International Conference on Embedded Technology, Chelmsford, MA, May 2-5, 2006. 28. A. Engin, A. Tambawala, M. Swaminathan, S. K. Bhattacharya, P. Pramanik, K. Yamazaki, “Dielectric constant and loss tangent characterization of thin high-K dielectrics using corner-to-corner plane probing”, Electrical Performance of Electronic Packaging, Scottdale, Arizona, October, 2006.
29. L. Wan, P. M. Raj, D. Balaraman, P. Muthana, S. K. Bhattacharya, M. Varadarajan, I. R. Abothu, M. Swaminathan, R. Tummala, “Embedded decoupling capacitors in high speed circuits”, Electronic Components and Technology Conference Proceedings, May, 2005, pp 1617– 1622.
30. P. Muthana, M. Swaminathan, R. Tummala, V. Sundaram, L. Wan, S. K. Bhattacharya, P. M. Raj, “Packaging of multi-core microprocessors: tradeoffs and potential solutions”, Electronic Components and Technology Conference Proceedings, 31 May-3 June 2005, Vol 2, pp 1895 – 1903.
31. N. Kumbhat, P.M. Raj, R. Pucha, S. Atmur, R. Doraiswamy, V. Sundaram, S. K. Bhattacharya, S. Sitaraman, R. Tummala, “Recent Advances in Ceramic Composite Substrate Materials for HighýDensity and High Reliability Packaging Applications”, Electronic Components and Technology, Proceedings, June 2005, pp 1364 – 1372.
32. M. Varadarajan, S. K. Bhattacharya, R. Doraiswami, A. Rao, N. J. Rao, G. May, L. Conrad, R. Tummala, “International Collaboration in Packaging Education: Hands-on System-on-Package Graduate Level Courses at Indian Institute of Science and Georgia Tech PRC, 55nd Electronic Components and Technology Conference, Lake Buena Vista, Fl, June 2005, Vol 2, pp 1930-1934.
33. R. Doraiswami, S. K. Bhattacharya, I. R. Abothu, R. Tummala, “Variable embedded capacitor for active system packaging”, 55nd Electronic Components and Technology Conference, Lake Buena Vista, FL, June 2005, pp 1574-1577.
34. D. Balaraman, P. Raj, I. Abothu, S. K. Bhattacharya, M. Sacks, M. Lance, H. Meyer, M. Swaminathan, R. Tummala, “Exploring limits of low cost organic compatible high K ceramic thin films for embedded decoupling applications”, 55nd Electronic Components and Technology Conference, Lake Buena Vista, Fl, June 2005, Vol 2, pp 1215-1221.
35. P. Muthana, M. Swaminathan, R. Tummala, P. M. Raj, E. Engin, L. Wan, D. Balaraman, S. K. Bhattacharya, Design, modeling and characterization of embedded capacitor networks for mid-frequency decoupling in semiconductor systems, International Symposium on Electromagnetic Compatibility, Chicago, Aug. 2005, pp 638 – 643.
36. P. M. Raj, P. Muthana, T. Xiao, L. Wan, D. Balaraman, I. R. Abothu, S. K. Bhattacharya, M. Swaminathan; R. Tummala, “Magnetic nanocomposites for organic compatible miniaturized antennas and inductors”, Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium, 16-18 March 2005, pp 272 – 275.
37. K. J. Lee, S. K. Bhattacharya, M. Varadarajan, L. Wan, I. R. Abothu, V. Sundaram, P. Muthana, D. Balaraman, P. M. Raj, M. Swaminathan, S. Sitaraman, R. Tummala, P. Viswanadham, S. Dunford, J. Lauffer, “Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates”, Proceedings Advanced Packaging Materials: Processes, Properties and Interfaces, International Symposium, Irvine, CA, March 2005, pp 249 – 254.
38. L. Conrad, S. K. Bhattacharya, R. Doraiswami, M. Varadarajan, G. May and R. Tummala “Development and implementation of a hands-on multi-disciplinary ‘Design, Build, Operate’ course series", 8th UICEE Annual Conference on Engineering Education, Kingston, Jamaica, February 2005, pp 193-198.
39. K. Lee, R. Pucha, M. Varadarajan, S. K. Bhattacharya, S. Sitaraman, R. Tummala, “Reliability assessment of embedded capacitors in multi-layered microvia organic substrates”, Proceedings of the IMAPS International Symposium on Microelectronics, Philadelphia, September 2005, pp 98-104.
40. P. Muthana, M. Swaminathan, R. Tummala, V. Sundaraman, L. Wan, S. K. Bhattacharya, E. Engin, P. Raj, “Design, modeling, and measurement of embedded decoupling capaitors for power delivery in the mid-frequency”, Proceedings of the IMAPS International Symposium on Microelectronics, Philadelphia, September, 2005, pp 506-511
41. S. K. Bhattacharya, M. Varadarajan, P. Chahal, K. Lee, A. Bhattacharjee, R. Tummala, S. Sitaraman, J. Papapolymerou, M. Tentzeris, J. Laskar, “SOP Embedded Thin Film Resistors on High and Low Loss Thick Film Dielectrics”, ASME InterPACK 2005, San Francisco, July, 2005.
42. P. Raj, D. Balaraman, V. Govind, L. Wan, R. Abothu, R. Gerhadt, S. K. Bhattacharya, M. Swaminathan and R. Tummala “High Frequency characteristics of Nanocomposite thin film “Supercapacitors and their stability for embedded decoupling”, 6th Electronic Packaging and Technology Conference, Singapore, December 2004, pp 154-161 (OUTSTANDING TECHNICAL PAPER AWARD).
43. K. Lim, L. Wan, D. Guidotti, S. Pinel, V. Sundaram, G. White, F. Liu, S. K. Bhattacharya, R. Doraiswami, M. Tentzeris, J. Laskar, R. Tummala, “System-on-a-Package (SOP) Module Development for a Digital, RF and Optical Mixed Signal Integrated System”, 54th Electronic Components and Technology Conference, Las Vegas, June, 2004, pp 1693-1697.
44. D. Balaraman, V. Patel, P. M. Raj, L. Wan, S. K. Bhattacharya, I. R. Abothou, M. Swaminathan, M. Sacks, R. Tummala, “Simultaneous Switching Noise Suppression Using Hydrothermal Barium Titanate Thin Film Embedded Capacitors”, 54th Electronic Components and Technology Conference, Las Vegas, June, 2004, pp 282-289.
45. I. R. Abothou, P. M. Raj, D. Balaraman, S. K. Bhattacharya, M. Sacks, R. Tummala, “Development of high k embedded capacitors on PWB”, 54th Electronic Components and Technology Conference, Las Vegas, June, 2004, pp 514-520.
46. M. Damani, R. Pucha, S. K. Bhattacharya, S. Sitaraman, R. Tummala, “Physics Based Reliability Assessment of Embedded Passives”, 54th Electronic Components and Technology Conference, Las Vegas, June, 2004, pp 2027-2031.
47. A. Aggarwal, K. Naeli, P. M. Raj, F. Ayazi, S. K. Bhattacharya, R. Tummala, “MEMS Composite Structures for Tunable Capacitors and IC-Package Nano Interconnects”, 54th Electronic Components and Technology Conference, Las Vegas, June, 2004, pp 835-842.
48. S. Bhatevara, S. K. Bhattacharya, D. Sutter, E. Kamen, G. May, R. Tummala, S. Harrington, “Mechatronics toward development of a fully automated meniscus coating system”, 54th Electronic Components and Technology Conference, Las Vegas, June, 2004, pp 2009-2014.
49. N. Kumbhat, P. M. Raj, S. Bansal, R. Doraiswami, S. K. Bhattacharya, V. Sundaram, R. Tummala, “Next generation board materials technology for Ultra-High Density and Fine-Pitch Reliable Interconnect Assembly”, 54th Electronic Components and Technology Conference, Las Vegas, June, 2004, pp 1843-1857.
50. V. Sundaram, G. White, S. K. Bhattacharya, R. Tummala, “System-on-a-Package (SOP) Module Development for a Digital, RF and Optical Mixed Signal Integrated System”, 54th Electronic Components and Technology Conference, Las Vegas, June, 2004, pp 17-23.
51. N. Kumbhat, R. Pucha, S. Hedge, P. M. Raj, R. Doraiswami, S. K. Bhattacharya,, S. Sitaraman, R. Tummala, S. Hayes, S. Atmur, “Novel board materials technology for next generation packaging”, 9th International Symposium and Exhibition on Advanced Packaging Materials, Atlanta, Georgia, March, 2004, pp 247-252.
52. I. R. Abothu, P. M. Raj, D. Balaraman, S. K. Bhattacharya, M. Sacks, and R. Tummala, “Low cost embedded capacitor technology with hydrothermal and sol-gel process”, 9th International Symposium on Advanced Packaging Materials, Atlanta, Georgia, March, 2004, pp 78-83 (BEST PAPER AWARD).
53. F. Liu, R. Tummala, V. Sundaram, D. Guidotti, Z. Huang, Y. Chang, I. Abothu, P. M. Raj, S. K. Bhattacharya, D. Balaraman, G. K. Chang, “Multifunctional integrated substrate technology for high density SOP packaging”, HDP, Shanghai, June, 2004, pp 83-90.
54. D. Balaraman, P. Markondeya Raj, S. Dalmia, I. Abothu, S. K. Bhattacharya, L. Wan, M. Sacks, M. Swaminathan and R. Tummala, “Integration of Hydrothermal and Sol-Gel Derived Ceramic Film Capacitors for Next-Generation Convergent Microsystems”, Presented at 106th Annual Meeting and Exposition of The American Ceramic Society held during April, 2004.
55. P. Raj, S. Hedge, R. Pucha, V. Sundaram, F. Liu, S. K. Bhattacharya, S. Atmur, S. Hayes, S. Sitaraman, R. Tummala, “Novel board materials for next generation microelectronics technology”, 106th Annual Meeting and Exposition of The American Ceramic Society held during April, 2004.
56. V. Sundaram, R. Tummala, G. White, K. Lim, L. Wan, D. Guidotti, F. Liu, S. K. Bhattacharya, P. M. Raj, I. Abothou, R. Doraiswami, R. Pucha, S. Sitaraman, M. Tentzeris, J. Laskar, G. K. Chang, M. Swaminathan, “First Single Module Demonstration of SOP with Digital, Optical, and RF for last mile Broadband Application”, ICEP, Tokyo, April, 2004, pp 399-404.
57. N. Kumbat, R. Pucha, P. Raj, V. Sundaram, S. K. Bhattacharya, E. Bonjo, S. Atmur, S. Sitaraman, R. Tummala, “Development and Evaluation of lo cost C-SiC substrates for high density microvia and solder joint reliability”, IMAPS Annual Conference, Long Beach, CA, November 2004.
58. K. Brownlee, P. M. Raj, S. K. Bhattacharya, K. Shinotani, R. Tummala, C. P. Wong, “Evaluation of low stress dielectrics for board applications”, 53rd Electronic Components and Technology Conference, New Orleans, May, 2003.
59. S. Bansal, P. M. Raj, K. Shinotani, S. K. Bhattacharya, R. Tummala, “In-situ Stress and Warpage Measurements to investigate reliability of flip-chip on board assembly without underfill”, 53rd Electronic Components and Technology Conference, New Orleans, May, 2003, pp 148-155.
60. D. Balaraman, P. Markondeya Raj, I. Abothu, S. K. Bhattacharya, S. Dalmia, L. Wan, M. Swaminathan, R. Tummala, “Integration and High-frequency characterization of PWB-compatible pure Barium Titanate films synthesized by modified hydrothermal techniques (< 100o C)”, 53rd Electronic Components and Technology Conference, New Orleans, May, 2003, pp 1520-1527.
61. N. Kumbat, P. Raj, S. Bansal, R. Doraisami, S. K. Bhattacharya, R. Tummala, S. Hayes, S. Atmur, “New package/board materials technology for next-generation convergent Microsystems”, Electronics Packaging Technology Conference (EPTC 2003), December 2003, pp 331 – 335.
62. D. Balaraman, P. Raj, R. Abothu, M. Sacks, S. K. Bhattacharya, R. Tummala, M. Lance, “Synthesis of Ferroelectric films for integral capacitors”, IMAPS, Boston, 2003, pp 200-206.
63. S. Bansal, P. M. Raj, S. Banerji, K. Shinotani, S. K. Bhattacharya, R. Tummala, and M. J. Lance, “Reliability assessment of high density multi-layer board assembly using Shadow Moire and luminescence spectroscopy”, 4th Electronics Packaging Technology Conference, Singapore, December, 2002, pp 126-132.
64. D. Balaraman, P. M. Raj, S. K. Bhattacharya, R. Tummala, “Novel hydrothermal processing (<100o C) of ceramic-polymer composites for integral capacitor applications”, 52nd Electronic Components and Technology Conference, San Diego, May, 2002, pp 1699-1703.
65. K. Brownlee, P. M. Raj, S. K. Bhattacharya, K. Shinotani, R. Tummala, C. P. Wong, “Liquid crystal polymers for high performance system-on-package substrate”, 52nd Electronic Components and Technology Conference, San Diego, May, 2002, pp 676-680.
66. S. Dalmia, S. Lee, S. K. Bhattacharya, M. Swaminathan, F. Ayazi, “Design and optimization of high Q RF passives on SOP based organic substrates”, 52nd Electronic Components and Technology Conference, San Diego, May, 2002, pp 495-503.
67. R. Doraiswami, J. Li, S. K. Bhattacharya, L. Conrad, G. May, R. Tummala, “Hands-on module packaging education at Georgia Tech”, 52nd Electronic Components and Technology Conference, San Diego, May, 2002, pp 1517-1523.
68. D. Balaraman, P. M. Raj, S. K. Bhattacharya, R. Tummala “Low temperature hydrothermal synthesis of high-k low loss barium titanate films for integral capacitors”, 4th Electronics Packaging Technology Conference, Singapore, December, 2002, pp 79-84.
69. T. Ogawa, Y. Taguchi, A. Erbil, S. K. Bhattacharya, “Development of lead free high K dielectrics for integral capacitor using MOCVD”, IEEE 8th International Advanced Packaging Materials Conference, Stone Mountain, Georgia, March, 2002, pp 1-6.
70. D. Balaraman, S. K. Bhattacharya, F. Ayazi, J. Papapolumerou, “Low cost low actuation voltage copper RF MEMS Switches”, Proc. 2002 IEEE MTT-S International Microwave Symposium (IMS 2002), Seattle, WA, June 2002, pp 1225-1228.
71. S. Lee, S. Min, S. Kim, S. Dalmia, V. Sundaraman, S. K. Bhattacharya, G. White, F. Ayazi, J. Kenney, M. Swaminathan, R. Tummala, “High performance spiral inductors embedded on organic substrates for SOP applications”, Proc. 2002 IEEE MTT-S International Microwave Symposium (IMS 2002), Seattle, WA, June 2002, pp 2229-2232.
72. S. Dalmia, F. Ayazi, M. Swaminathan, S.H. Min, S.H. Lee, W. Kim, D.S. Kim, S. K. Bhattacharya, V. Sundaram, G. White, and R. Tummala, "Design of inductors in organic substrates for 1-3 GHz wireless applications," Proc. 2002 IEEE MTT-S International Microwave Symposium (IMS 2002), Seattle, WA, June 2002, pp 1405-1408.
73. S. Dalmia, S. Lee, S. K. Bhattacharya, F. Ayazi, M. Swaminathan, “High Q RF passives on organic substrates using a low cost low temperature laminate process”, IEEE Design, Test, Integration and Packaging (DTIP2002) of MEMS/MOEMS Conference, Cannes Mandelieu, France, May, 2002.
74. R. Tummala, S. Dalmia, D. Balaraman, J. Hobbs, H. Windlass, A. Bavisi, P. M. Raj, S. H. Lee, S. K. Bhattacharya, G. White, F. Ayazi, M. Swaminathan, A. Erbil, T. Ogawa, “Recent Advances in Integral Passives Research at Georgia Tech”, International Conference on Electronic Packaging”, Tokyo, Japan, April 2002, pp 116-123.
75. K. Brownlee, S. K. Bhattacharya, K. shinotani, C. P. Wong, R. Tummala, “Liquid crystal polymers for high performance SOP application”, IEEE 8th International Advanced Packaging Materials Conference, Stone Mountain, Georgia, March, 2002, pp 249-253.
76. S. Banerjee, P. M. Raj, F. Liu, K. Shinotani, S. K. Bhattacharya, R. Tummala, “The role of stiff base substrates in warpage reduction for future high density wiring requirements”, IEEE 8th International Advanced Packaging Materials Conference, Stone Mountain, Georgia, March, 2002, pp 221-225.
77. H. Windlass, P. Raj, D. Balaraman, S. K. Bhattacharya, R. Tummala, “Processing of Polymer-Ceramic Nanocomposites for System-On-Package Applications”, 51st Electronic Components and Technology Conference, Orlando, Florida, May, 2001, pp 1201-1206.
78. S. K. Bhattacharya, J. Hobbs, M. Varadarajan, O. Sanchez, R. Tummala, G. May, “A Hands-on Multi-disciplinary Product Development Course for Microsystems Packaging Education at Georgia Tech”, 51st Electronic Components and Technology Conference, Orlando, May, 2001, pp 405-409.
79. V. Sundaram, S. Dalmia, J. Hobbs, S. K. Bhattacharya, M. Swaminathan, G. White, R. Tummala, "Recent Advances in SOP Integration", Invited Paper in Proceedings of the International Conference on Solid State Materials and Devices, September 2001.
80. T. Ogawa, S. K. Bhattacharya, A. Erbil, “Lead free high K dielectrics using MOCVD”, IMAPS, High Density Packaging Conference, Baltimore, October, 2001.
81. P. Raj, K. Shinotani, M. Seo, S. K. Bhattacharya, V. Sundaram, S. Zama, J. Lu, C. Zweben, G. White, R. Tummala, “Selection and Evaluation of Materials for Future SOP Substrate”, 51st Electronic Components and Technology Conference, Orlando, May, 2001, pp 1193-1197.
82. H. Windlass, P. Raj, D. Balaraman, S. K. Bhattacharya, R. Tummala , “Colloidal Processing of Polymer Ceramic Nanocomposites for Integral Capacitors”, IMAPS International Symposium on Advanced Packaging materials, Braselton, 2001, pp 393-398.
83. S. Banerji, P. Raj, K. Shinotani, M. Seo, C. Zweben, S. K. Bhattacharya, R. Tummala, “Control of warpage during build-up of multilayered high-density wiring with stiff and low-CTE base substrates”, International Conference and Exhibition on High Density Interconnect and Systems Packaging, Santa Clara, April 2001, pp 279-284.
84. R. Tummala, K. Shintotani, V. Sundaram, S. K. Bhattacharya, G. White, F. Liu, P. Raj, L. Wan, S. Lee, D. Ravi, “SOP vs SOC at Georgia Tech PRC”, International Conference on Electronic Packaging, Tokyo, Japan, April, 2001, pp 1-8.
85. K. Shintotani, M. Seo, P. M. Raj, S. Zama, J. Lu, S. K. Bhattacharya, C. Zweben, G. White, R. Tummala, “Selection and evaluation of materials for future SOP substrates”, International Conference on Electronic Packaging, Tokyo, Japan, April, 2001, pp 382-387.
86. S. K. Bhattacharya, P. Raj, K. Shinotani, K. Moon, R. Tummala, G. May, “An alternative method for thin film polymer coating on large area SOP substrates”, ASME Interpack, Kauai, July, 2001.
87. S. K. Bhattacharya, S. Sitaraman, I. C. Ume, D. Baldwin, C. P. Wong, J. Qu, R. Tummala, “Large area processing using small area substrates: A low cost MCM-D processing”, ASME Interpack, Kauai, July, 2001.
88. J. Wu, S. K. Bhattacharya, M. Wong, C. Lloyd, R. Tummala, C.P. Wong, H. Pogge, "A Novel High-Performance Encapsulant for System on Chip Application", IMAPS International Conference on Emerging Microelectronics, EMIT 2K, Bangalore, India, February, 2000, TP9-5, pp 318-329.
89. O. Misman, S. K. Bhattacharya, A. Erbil, R. Tummala, "PWB Compatibel Thick and Thin Film integral capacitors" IMAPS International Conference on Emerging Microelectronics, EMIT 2K, Bangalore, India, February, 2000, TP6-1, pp 143-150.
90. S. Canumalla, L. Kessler, S. K. Bhattacharya, “Characterization of thin layers in microelectronic packaging using acoustic microscopy”, IEEE 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Helsinki, Finland, June, 2000, pp 225-231.
91. J. Wu, S. K. Bhattacharya, M. Wong, C. Lloyd, R. Tummala, C.P. Wong, H. Pogge, "Evaluation and characterization of high-performance filling encapsulant for system chip application", IEEE 50th ECTC, pp 937-943, Las Vegas, May, 2000.
92. H. Windlas, P. M. Raj, S. K. Bhattacharya, R. Tummala, “Optimized suspension formulations for improved dielectric properties of ceramic-polymer nanocomposites for integral capacitor”, IMAPS Advanced Passive Technology Workshop, Denver, April, 2000.
93. S. K. Bhattacharya, S. Bhatevara, R. Madayag, E. Kamen, G. May, S. Harrington, "An automated workcell for meniscus coating on 24 inch packaging substrates”, Proceedings of the 7th Mechatronics International Conference, Paper Number M2000-180, Atlanta, GA, September, 2000.
94. S. Bhatevara, S. K. Bhattacharya, H. Morales, S. Kauffman, E. Kamen, G. May, "Low cost, high throughput, large area meniscus coating for MCM-D and MCM-L substrates" Proceedings of IMAPS 2000, Boston, MA, September 20-22, 2000, pp 74-79.
95. P. M. Raj, H. Windlass, K. Shinotani, S. K. Bhattacharya, V. Sundaram and R. Tummala, “Delamination issues in integration of highly filled polymer-ceramic nanocomposite films on MCM-L compatible substrates”, 50th ECTC, pp 1681-1685, Las Vegas, May, 2000,
96. Dang, I. C. Ume, S. K. Bhattacharya, “In-situ warpage measurement during thermal cycling of dielectric coated flexible SS substrates for large area MCM-D packaging”, ASME International Mechanical Engineers Conference, Electronics Manufacturing Issue EEP-Vol 104, pp 169-179, Nashville, Tennessee, November, 1999.
97. S. K. Bhattacharya, R. Tummala, “Epoxy nanocomposite capacitors for integral passives technology”, ASME International Mechanical Engineers Conference, Technical Paper 99-IMECE/EEP-25, pp 1-8, Nashville, Tennessee, November, 1999.
98. Dang, I. C. Ume, S. K. Bhattacharya, “A study on warpage of flexible SS substrates for large area MCM-D packaging”, Advances in Electronic Packaging, EEP Volume 26, Number 2, pp 1841-1847, ASME INTERPAK, Maui, Hawaii, June, 1999.
99. R. Tummala, G. White, V. Sundaram, S. K. Bhattacharya, “SOP: The Microelectronics for the 21st Century with Integral Passive Integration”, Proceedings, IMET/IMC Microelectronic Packaging Innovation for the New Century”, Sonic City-Omiya, Tokyo, April, 1999, pp 267-275.
100. C. Powers, M. Realff, and S. K. Bhattacharya, “A decision tool for design of manufacturing systems for integrated passives substrates”, IMAPS 4th Advanced Technology Workshop on Integrated Passives Technology, April 9-10, 1999, pp 38-45.
101. T. Troutman, S. K. Bhattacharya, C. P. Wong, and R. Tummala, “Development of low viscosity, high dielectric constant polymers for integral passive applications” Proceedings of the 5th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, Georgia, March, 1999, pp 169-173.
102. R. Tummala, P. Chahal, S. K. Bhattacharya, “Recent advances in Integral Passives at PRC”, Proceeding of the IMAPS Nordic 35th Annual Conference, Globen, Stockholm, Sweden, Section M-2, September, 1998, pp 1-15.
103. S. K. Bhattacharya, Y. Kim, P. Chahal, M. Allen, R. Tummala, R. L. Hubbard, “MCM-L compatible integrated resistors and capacitors”, Proceedings of the 4th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, Georgia, March, 1998, pp 295-299.
104. S. K. Bhattacharya, R. Tummala, M. Allen, P. Kohl, S. Bidstrup, G. White, S. Streiffer, A. Singh, A. Kingon, “Next generation filled-polymer dielectrics”, Proceedings of the IEEE 2nd International Conference on Emerging Microelectronics & Interconnect Technologies, Bangalore, India, February, 1998, pp 308-313.
105. S. K. Bhattacharya, P. Chahal, R. Tummala, G. White, “Integration of polymer/ceramic thin film capacitors on PWB”, Proceedings of the 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, Georgia, March, 1997, pp 68-70.
106. J. Park, S. K. Bhattacharya, M. Allen, “Fully integrated passive modules for filter applications using low temperature processes”, Proceedings of the IMAPS International Symposium on Microelectronics, Philadelphia, October, 1997, pp 592-97.
Last modified January 14, 2009.
