Press release excerpt:
Ms. Vera Lopez’s paper entitled, “Hybrid Silicon-Organic Packaged Antenna Array at 60 and 80 GHz Using a Low-Cost Bonding Technique,” was coauthored with her Ph.D. advisor John Papapolymerou, G. Ponchak of the NASA Glenn Research Center, and A. Akiba, S. Mitarai, and K. Ikeda of Sony Corporation. Her work presents a hybrid silicon-organic packaged mm-wave antennas that is flip-chip bonded to a 400 µm thick silicon substrate through gold bumps and a non-conductive film (NCF) adhesive layer.
