Dr. Chad Patterson

Dr. Chad Patterson

Dr. Chad Patterson,
Doctorate Alumnus

Background

Mr. Patterson received the B.S., M.S. and Ph.D. degrees in electrical engineering from the Georgia Institute of Technology in 2006, 2008 and 2012, respectively. He was a member of the Microwave Circuit Technology (MircTech) group at Georgia Tech from May 2007 until his graduation in August 2012. His research focused on the design, fabrication and characterization of microwave/millimeter wave passive components and packaging solutions for next-generation communication and radar antennas. Prior to joining the MircTech team, he was employed as an intern at the Army Research Laboratory in Adelphi, MD, where he worked on high frequency antenna design and automated antenna measurement systems. He is currently working for Raytheon’s Space and Airborne Systems team in El Segundo, CA. (updated August 2012)

Awards

  • 2012 H. A. Wheeler Prize Paper Award of the IEEE Antennas and Propagation Society (AP-S)

Research Interests

  • Millimeter Wave Component Packaging
  • 3D Packaging Techniques
  • RF MEMs Design
  • High Frequency Antenna Design, Packaging and Integration

Experience

  • Research Assistant (05/07-present) – Georgia Institute of Technology
  • Summer Intern (5/02-8/02, 5/03-8/03, 5/05-8/05) – Army Research Laboratory
    • Used LabVIEW to automate the process for antenna data acquisition and analysis in an Anechoic Chamber.
    • Designed, simulated and fabricated 2D Antenna Arrays.

Publications

Peer-reviewed Journal Papers

  1. C. E. Patterson, J. Ajoian, J. Papapolymerou, G. S. May, “LCP characterization of broadband RF performance with consideration of fabrication tolerances for CSLP substrate suitability,” submitted to IEEE Tranactions. on Components, Packaging, and Manufacturing Technology, June 2012.
  2. C. E. Patterson, J. Ajoian, S. K. Bhattacharya, J. Zepess, S. Leiphart, W. G. Trueheart, Z. Coffman, J. Papapolymerou, “A 12 GHz BAW filter on a 3D organic package,” submitted to IEEE Microwave and Wireless Components Letters, May 2012.
  3. E. Juntunen, C. E. Patterson, W. Khan, S. K. Bhattacharya, D. Dawn, J. Laskar, J. Papapolymerou, “A Q-band low-power 2-channel vector modulator in 45-nm CMOS for LINC transmitters,” submitted to IEEE Transactions on Microwave Theory and Techniques, May 2012.
  4. C. E. Patterson, W. T. Khan, G. E. Ponchak, G. S. May, J. Papapolymerou, “A 60 GHz active receiving switched-beam antenna array with integrated butler matrix and GaAs amplifiers,” accepted to IEEE Transactions on Microwave Theory & Techniques, July 2012.
  5. C. A. D. Morcillo, C. E. Patterson, B. Lacroix, C. Coen, J. C. H. Poh, J. D. Cressler, J. Papapolymerou, “An ultra-thin, high-power and multilayer organic antenna array with T/R functionality in the X band,” accepted to IEEE Transactions on Microwave Theory & Techniques, March 2012.
  6. C. H. J. Poh, C. E. Patterson, S. K. Bhattacharya, S. D. Philips, N. E. Lourenco, J. D. Cressler, J. Papapolymerou, “Packaging effects of multiple X-band SiGe LNAs embedded in an organic LCP substrate,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, early access, 2012.
  7. C. E. Patterson, T. K. Thrivikraman, A. M. Yepes, S. M. Begley, S. K. Bhattacharya, J. D. Cressler, J. Papapolymerou, “A lightweight organic X-band phased array with integrated SiGe amplifiers and phase shifters,” in IEEE Transactions on Antennas and Propagation, vol. 59, issue 1, pp. 100-109, January 2011. [2012 H. A. Wheeler Prize Paper Award]

Conference Proceedings

  1. C. E. Patterson, D. Dawn, J. Papapolymerou, “A W-band CMOS PA encapsulated in an organic flip-chip package,” presented at the 2012 IEEE International Microwave Symposium, June 2012.
  2. C. A. D. Morcillo, C. E. Patterson, J. Papapolymerou, “Design of stripline beam-former network components for low-profile, organic phased arrays in the X band,” in IEEE Radio & Wireless Symposium, pp. 179-182, 2012. [1st Place Student Paper Competition]
  3. C. E. Patterson, T. K. Thrivikraman, S. K. Bhattacharya, C. T. Coen, J. D. Cressler, J. Papapolymerou, “Development of a multilayer organic packaging technique for a fully embedded T/R module,” in European Microwave Conference, pp. 261-264, 2011. [Student Paper Competition Finalist]
  4. C. E. Patterson, S. K. Bhattacharya, J. Zepess, S. Leiphart, W. G. Trueheart, J. Ajoian, Z. Coffman, J. Papapolymerou, “A 7.45 GHz BAW filter on a low cost 3D organic package,” in IEEE International Microwave Symposium, 2011. [Student Paper Competition Finalist]
  5. C. A. D. Morcillo, C. E. Patterson, B. Lacroix, T. Thrivikraman, C. H. Poh, C. T. Coen, J. D. Cressler, J. Papapolymerou, “A lightweight, 64-element, organic phased array with integrated transmit-receive SiGe circuitry in the X band,” in IEEE International Microwave Symposium, 2011.
  6. W. T. Khan, S. K. Bhattacharya, C. E. Patterson, G. E. Ponchak, J. Papapolymerou, “Low cost 60 GHz RF front end receiver on organic substrate,” in IEEE International Microwave Symposium, 2011.
  7. E. A. Juntunen, W. T. Khan, C. E. Patterson, S. K. Bhattacharya, D. Dawn, J. Laskar, J. Papapolymerou, “An LCP packaged high-power, high-efficiency CMOS millimeter-wave oscillator,” in IEEE International Microwave Symposium, 2011.
  8. C. E. Patterson, T. K. Thrivikraman, A. M. Yepes, S. K. Bhattacharya, J. D. Cressler, J. Papapolymerou, “Implementation of a low cost, lightweight X-band antenna with integrated SiGe RF electronics,” in IEEE International Geoscience and Remote Sensing Symposium, pp. 681-684, 2010.
  9. C. E. Patterson, A. M. Yepes, T. K. Thrivikraman, S. K. Bhattacharya, J. D. Cressler, J. Papapolymerou, “A lightweight X-band organic antenna array with integrated SiGe amplifier,” in IEEE Radio & Wireless Symposium, pp. 84-87, 2010.
  10. C. H. J. Poh, T. K. Thrivikraman, S. K. Bhattacharya, C. E. Patterson, J. D. Cressler, J. Papapolymerou, “An LCP package model for use in chip/package co-design of an X-band SiGe low noise amplifier,” in IEEE EPEPS, pp. 203-206, 2009.
  11. C. E. Patterson, T. K. Thrivikraman, S. K. Bhattacharya, C. H. J. Poh, J. D. Cressler, J. Papapapolymerou, “Organic wafer-scale packaging for X-band SiGe low noise amplifier,” in European Microwave Conference, pp. 141-144, 2009.
  12. C. Patterson, S. Horst, S. Bhattacharya, J.D. Cressler, J. Papapolymerou, “Low cost organic packaging for silicon based mm-wave wireless systems,” in European Microwave Conference, pp. 1242-1245, 2008.
  13. W. O. Coburn, S. D. Keller, C. E. Patterson, R. Harris, “An aperture-coupled patch antenna design for improved impedance bandwidth,” Army Research Laboratory, Adelphi, MD, Nov. 2006.

Contact Information

Email: cpatterson@gatech.edu

 

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MiRCTECH Affiliations


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